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Germany – Laboratory, optical and precision equipments (excl. glasses) – Flip Chip Die Bonder

Fair - Facility For Antiproton And Ion Research In Europe Gmbh · Germany government procurement

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$253,538
Est. Value
Active
Status

Opportunity Overview

The Flip-chip Die bonder should include the following process modules: - Precision die bonding (face up) - Flip chip bonding (face down) - adapted system work table - chip and substrate heating with process gas enclosure - software-controlled bonding force module - ultrasonic bonding module - in-situ-monitoring with video camera - form generator for creating reference elements for face up alignment - tool tip changing module - three different tool tips - tool tip support including heater - dispenser module for paste and liquids - UV-curing module - die-eject module

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Solicitation Details

Issuing agencyFair - Facility For Antiproton And Ion Research In Europe Gmbh
CountryGermany
CategoryProfessional Services
Estimated value$253,538
CPV38000000
PublishedSeptember 29, 2026
Procurement stageRequest for Proposal (RFP)
Response dueNot specified / rolling
StatusOpen — accepting responses
Original languageGerman — members read it in their own language
Official sourceView original notice
Last verifiedOctober 04, 2026

Source: Tenders Electronic Daily (TED), © European Union. Notice content reused under Commission Decision 2011/833/EU; editorial content licensed CC BY 4.0. GlobalGov is not affiliated with the European Union.

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