Opportunity Overview
Background
The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption.
The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products.
NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore.
Description
The University of Strathclyde has a requirement for automated laser chip tester capable of performing burn-in testing.
The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption.
The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products.
NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore.
Description
The University of Strathclyde has a requirement for automated laser chip tester capable of performing burn-in testing.
Your competitors are watching the same crowded contracts everyone else is. Track this opportunity and every one like it worldwide, set deadline alerts, and win where they aren’t. Free for 14 days, no card.
Start FreeSolicitation Details
| Issuing agency | University of Strathclyde |
|---|---|
| Country | United Kingdom |
| Category | Government Procurement |
| CPV | 38000000 |
| Published | August 03, 2026 |
| Procurement stage | Request for Proposal (RFP) |
| Response due | September 07, 2026 |
| Status | Open — accepting responses |
| Official source | View original notice |
| Last verified | August 10, 2026 |
Contains public sector information licensed under the Open Government Licence v3.0. Source: UK Government (Find a Tender).
Related Opportunities in United Kingdom
See every United Kingdom Government Procurement opportunity your competition is missing. Free for 14 days.
Get real-time alerts, competitive intelligence, and deadline tracking for this and every market worldwide.
Start Free Trial — No Card RequiredFree 14-day trial · no card required
See who is already competing here →Get a free United Kingdom Government Procurement intelligence report in your inbox
A personalized report on United Kingdom Government Procurement opportunities, emailed in 5-10 minutes. One per month, no account needed.