Opportunity Overview
Background
The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption.
The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products.
NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore.
Description
This tender is to ensure that the devices packaged by the facility or our clients meet industry standards, the facility is planning to procure three reliability testing equipment/systems as follows:
(1) Climatic chamber 1 for high temperature bias test,
(2) Climatic chamber 2 for high temperature and high humidity bias test,
(3) Thermal shock test chamber.
The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption.
The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products.
NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore.
Description
This tender is to ensure that the devices packaged by the facility or our clients meet industry standards, the facility is planning to procure three reliability testing equipment/systems as follows:
(1) Climatic chamber 1 for high temperature bias test,
(2) Climatic chamber 2 for high temperature and high humidity bias test,
(3) Thermal shock test chamber.
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Start FreeSolicitation Details
| Issuing agency | University of Strathclyde |
|---|---|
| Country | United Kingdom |
| Category | Transportation |
| Estimated value | $1.3M |
| CPV | 38000000 |
| Published | July 20, 2026 |
| Procurement stage | Request for Proposal (RFP) |
| Response due | August 19, 2026 |
| Status | Open — accepting responses |
| Official source | View original notice |
| Last verified | August 09, 2026 |
Contains public sector information licensed under the Open Government Licence v3.0. Source: UK Government (Find a Tender).
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