Germany – Laboratory, optical and precision equipments (excl. glasses) – DRIE-Anlage

General Description: A specific machine park for the fabrication, processing, and integration of micro and nanosystems and related quantum technologies is being procured for the new cleanroom. This tender is for the procurement of equipment for a classic microstructuring process chain for the cleanroom. A reactive ion etching (RIE) system with inductively coupled plasma (ICP) is planned for etching silicon substrates or layers. The tender covers only the specified system; the necessary media and peripherals will be provided separately by the DLR. DRIE System / Description: A deep reactive ion etching (DRIE) system is required for etching deep structures in silicon. This process will be used to etch high aspect ratio structures into Si substrates or Si layers on 100 mm and 150 mm wafers using resist and hard masks. Scope of Contract • System according to specifications, including delivery, commissioning, acceptance testing, and training • New and refurbished systems can be offered. Further information can be found in the attached specifications (contract documents).