Opportunity Overview
TYAD seeks innovative commercial methodologies, processes, and technologies to rapidly scale Circuit Card Assembly (CCA) production using our existing Surface Mount Technology (SMT) automated lines and through-hole component machinery. We are soliciting novel approaches to design, reverse engineering, obsolescence management, and supply chain resilience that will close internal capability gaps and accelerate timelines for building essential CCA manufacturing data.
The Call for Solutions document (.pdf), outlining the full problem statement, required solution attributes, submission requirements, and evaluation phases can be found in the "Attachments" section below.
The following shall be utilized in the email subject line: "Call for Solution-CCA_26_01"
The Army Open Solicitation (AOS) that this Call for Solution is associated with can be found at: https://sam.gov/workspace/contract/opp/a827ea963c6c4344b3494ad83a08d25c/view
Please review the AOS posting and associated attachments, in addition to the attachment for this call, for further information on how the AOS is structured.
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Start FreeSolicitation Details
| Issuing agency | W6QK ACC-APG Cont Ct TYAD OFC |
|---|---|
| Country | United States |
| Category | Government Procurement |
| NAICS | 334418 |
| PSC | 5980 |
| Published | July 10, 2026 |
| Procurement stage | Active solicitation |
| Closed | August 10, 2026 |
| Status | Closed — no longer accepting responses |
| Official source | View original notice |
| Last verified | October 11, 2026 |
Source: U.S. Government (SAM.gov) — public domain. GlobalGov is not affiliated with or endorsed by the United States Government.
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